Laser: 405 nm (GaN), optional 325 nm
Resolution: down to ~0.8–1 µm
Writing area: up to ~100 × 100 mm (6-inch wafers)
Stage accuracy: ~0.1 µm (interferometer)
Vacuum: only substrate
Evaporation source: Tungsten boats/filaments (multi-source option)
Maximum temperature: ~1800 °C (source heating)
Vacuum: High vacuum, typically 10⁻⁶ Torr range
Chamber: Stainless steel with viewing window
Substrate holder: Rotatable for uniform coating
Laser source: Continuous wave UV laser (commonly 405 nm)
Resolution: ~1 µm feature size achievable
Writing area: Compatible with standard glass slides and small substrates
Stage control: High-precision motorized XYZ stage with sub- micron accuracy
Application: Direct-write patterning of polymers, biomaterials, and microstructures without the need for masks
Gas control: Mass flow controllers for mixing
Concentration: ppm to several thousand ppm
Temperature: Up to ~500 °C
Measurement: Real-time electrical response
Atmosphere: Air, inert, or humid environments
Maximum temperature: ~1200–1500 °C
Heating zones: 3 independently controlled zones for uniform temperature profile
Tube size: Typically quartz tube (1–3 inch diameter)
Atmosphere: Operates under vacuum or controlled gas flow
Gases: Compatible with inert, reactive, and process gases (Ar, N₂, O₂, H₂, etc.)
Maximum temperature: ~1200 °C
Heating zones: Single-zone tube furnace
Tube size: Quartz or alumina tube, up to ~1 inch diameter
Control: Digital temperature controller with RS485 interface
Atmosphere: Usable in air, vacuum, or inert gas environments
Plasma source: DBD / RF generator
Voltage: 1–30 kV
Frequency: kHz–MHz range
Gases: Air, O₂, Ar, N₂
Application: Surface treatment and sterilization
Vacuum: ~10⁻⁶ Torr
Probes: Micro-positioned with sub-micron accuracy
Temperature: Stage up to ~400 °C
Application: I–V/C–V testing in controlled atmosphere
Function: Source and measure voltage/current simultaneously
Current range: 1 fA to 1 A
Voltage range: 1 µV to 200 V
Resolution: 6½-digit precision
Application: Semiconductor, sensor, and device characterization
Magnification: Typically 10× to 1000× (depends on objectives)
Illumination: LED or halogen light source
Stage: Mechanical XY stage for sample movement
Focus: Coarse and fine focusing knobs
Application: Visual inspection, imaging, and microstructure analysis
Speed: 100–8000 rpm
Acceleration: Programmable ramp
Substrate: Up to ~100 mm
Dispensing: Manual or automated
Application: Thin-film coating of resists and polymers
Speed: Up to ~15,000 rpm
Capacity: Multiple tubes (variable rotor options)
Temperature: Adjustable cooling/heating from ~-20 °C to 40 °C
Control: Digital timer and speed settings
Application: Sample separation, biomaterials, and chemical processing
Pressure range: Up to several MPa depending on model
Accuracy: ±0.5% of full scale
Measurement: Mechanical or digital readout
Applications: Testing of taps, fittings, pipelines, and pressure components
Printing technology: Laser-based photopolymerization
Layer resolution: ~25–100 µm
Build volume: Varies by model, typically up to 300 × 300 × 300 mm
Light source: UV laser or LED
Application: High-precision prototyping and microfabrication of polymer parts
Voltage: ±10 V
Current: pA to A
Techniques: CV, LSV, EIS, chronoamperometry
Application: Battery, sensor, and corrosion testing
Temperature: Ambient to ~300 °C
Control: Programmable digital profiles
Capacity: Multiple shelves
Airflow: Forced convection
Application: Drying and thermal processing
Humidity: ~20–95% RH
Temperature: Ambient to ~70 °C
Control: Digital settings
Capacity: Multiple samples
Application: Environmental and reliability testing
Microscope: Trinocular
Stage: Precision XYZ
Function: 2D material transfer and alignment
Illumination: LED/halogen
Application: 2D material stacking and characterization
High-precision SLA resin 3D printer with 10″ 8K LCD and COB UV LED.
Build Volume: 219 × 123 × 250 mm | Resolution: ~29–35 µm.
Carbon fiber body, dual linear rail Z-axis, and strong build plate adhesion.
Supports multiple resins and offline USB printing.