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Prof. Rao R. Tummala
Georgia Tech
Introduction to Semiconductors and Packaging
Bio
Prof. Abhisek Dixit
IIT Delhi
Introduction to Devices
Prof. Rohit Y.
Sharma
IIT ropar
Fundamentals of Electrical
Design
Prof. Anandaroop Bhattacharya
IIT Kharagpur
Fundamentals of Thermal Technologies
Prof. Ganesh Subbarayan
Purdue University
Fundamentals of Thermo-mechanical Reliability
Dr. Ravi Bhatkal
MacDermid Alpha India
Fundamentals of Package Materials
Dr. Venky Sundaram
3D System Scaling LLC
Fundamentals of Substrates
Prof. Raj Pulugurtha
Florida International University
Fundamentals of Passive Components and Their Integration
Prof. Vanessa Smet
Fundamentals of Chip-to-Package Interconnect. & Assembly
Dr. Beth Keser
Zero ASIC
Fundamentals of Embedded & Fan Out Packaging
Dr. Siddharth Ravichandran, Chipletz.
UCLA
Fundamentals of 3D Packaging With and without TSV
Prof. Emmanouil M Tentzeris
Fundamentals of RF and Millimeter-wave Packaging
Dr. Ajey Jacobs
USC
Fundamentals of Opto-electronics packaging
Prof. Venkatesh KP Rao
BITS Pilani
Fundamentals of MEMS and Sensors packaging
Dr. Jack Moon
Fundamentals of Encapsulation, Molding, & Sealing
Dr. Sundar Kamath
Sanmina
Fundamentals of Printed Wiring Boards
Prof. Nilesh Badwe
IIT Kanpur
Fundamentals of Board Assembly
Prof. Shiladri Chakraborty
IIT Bombay
Power Electronics
