BITS Pilani: CREST - Resource Persons

BITS Pilani: CREST

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Prof. Rao R. Tummala

Georgia Tech

Introduction to Semiconductors and Packaging

Prof. Abhisek Dixit

IIT Delhi

Introduction to Devices

Prof. Rohit Y.

Sharma

IIT ropar

Fundamentals of Electrical

Design

Prof. Anandaroop Bhattacharya

IIT Kharagpur

Fundamentals of Thermal Technologies

Prof. Ganesh Subbarayan

Purdue University

Fundamentals of Thermo-mechanical Reliability

Dr. Ravi Bhatkal

MacDermid Alpha India

Fundamentals of Package Materials

Dr. Venky Sundaram

3D System Scaling LLC

Fundamentals of Substrates

Prof. Raj Pulugurtha

Florida International University

Fundamentals of Passive Components and Their Integration

Prof. Vanessa Smet

Georgia Tech

Fundamentals of Chip-to-Package Interconnect. & Assembly

Dr. Beth Keser

Zero ASIC

Fundamentals of Embedded & Fan Out Packaging

Dr. Siddharth Ravichandran, Chipletz.

UCLA

Fundamentals of 3D Packaging With and without TSV

Prof. Emmanouil M Tentzeris

Georgia Tech

Fundamentals of RF and Millimeter-wave Packaging

Dr. Ajey Jacobs

USC

Fundamentals of Opto-electronics packaging

Prof. Venkatesh KP Rao

BITS Pilani

Fundamentals of MEMS and Sensors packaging

Dr. Jack Moon

Georgia Tech

Fundamentals of Encapsulation, Molding, & Sealing

Dr. Sundar Kamath

Sanmina

Fundamentals of Printed Wiring Boards

Prof. Nilesh Badwe

IIT Kanpur

Fundamentals of Board Assembly

Prof. Shiladri Chakraborty

IIT Bombay

Power Electronics

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