Prof. Rao R. Tummala

Georgia Tech

Introduction to Semiconductors and Packaging

Bio

Prof. Abhisek Dixit

IIT Delhi

Introduction to Devices

Bio

Prof. Madhavan Swaminathan

Penn State

Fundamentals of Electrical Design

Bio

Prof. Anandaroop Bhattacharya

IIT Kharagpur

Fundamentals of Thermal Technologies

Bio

Prof. Ganesh Subbarayan

   Purdue University 

Fundamentals of Thermo-mechanical Reliability

Bio

Dr. Ravi Bhatkal

MacDermid Alpha India

Fundamentals of Package Materials

Bio

Dr. Venky Sundaram

3D System Scaling LLC

Fundamentals of Substrates

Bio

Prof. Raj Pulugurtha

Florida International University

Fundamentals of Passive Components and Their Integration

Bio

Prof. Vanessa Smet

Georgia Tech

Fundamentals of Chip-to-Package Interconnect. & Assembly

Bio

Dr. Beth Keser

Intel

Fundamentals of Embedded & Fan Out Packaging

Bio

Dr. Siddharth Ravichandran, Chipletz.

UCLA

Fundamentals of 3D Packaging With and without TSV

Bio

Prof. Emmanouil M Tentzeris

Georgia Tech

Fundamentals of RF and Millimeter-wave Packaging 

Bio

Dr. Ajey Jacobs

USC

Fundamentals of Opto-electronics packaging

Bio

Prof. Venkatesh KP Rao

BITS Pilani

Fundamentals of MEMS and Sensors packaging

Bio

Dr. Jack Moon

Georgia Tech

Fundamentals of Encapsulation, Molding, & Sealing

Bio

Dr.  Sundar Kamath

Sanmina

Fundamentals of Printed Wiring Boards

Bio (Brian Nelson)

Prof. Nilesh Badwe

IIT Kanpur

Fundamentals of Board Assembly

Bio

Prof. Kaushik Basu

IISc

Automotive electronics

Bio

Dr. Ravi Mahajan

Intel

Computing Systems

Bio

Prof. S. Sundar Kumar Iyer

IIT Kanpur

Flexible Electronics

Bio

Dr. Gokul Kumar

Micron

Memory Packaging & Manufacturing

Bio