September 2026

• IEEE Sensors Council Printed School: 11-12 Sept ~ 40 external students trained

• The workshop explores the future of printed and flexible sensor technologies. The central theme, "Empowering Innovation. Connecting Futures," focuses on applications in Smart Sensors, Flexible Electronics, Industrial Internet of Things (IoT), Health Monitoring, and Connected Devices.

• Why Printed Sensors Matter: They enable low-cost manufacturing, flexible/wearable devices, lightweight electronics, and smart packaging. They are widely used in healthcare, automotive, consumer electronics, agriculture, aerospace, and industrial automation.

• Keynote Speaker: 𝐏𝐫𝐨𝐟. 𝐇𝐢𝐝𝐞𝐭𝐨 𝐌𝐢𝐲𝐚𝐤𝐞,𝐏𝐫𝐨𝐟𝐞𝐬𝐬𝐨𝐫, 𝐆𝐫𝐚𝐝𝐮𝐚𝐭𝐞 𝐒𝐜𝐡𝐨𝐨𝐥 𝐨𝐟 𝐄𝐧𝐠𝐢𝐧𝐞𝐞𝐫𝐢𝐧𝐠, 𝐌𝐢𝐞 𝐔𝐧𝐢𝐯𝐞𝐫𝐬𝐢𝐭𝐲, 𝐉𝐚𝐩𝐚𝐧.

• Title of the Talks: 𝐈𝐧𝐝𝐮𝐬𝐭𝐫𝐲-𝐀𝐜𝐚𝐝𝐞𝐦𝐢𝐚 𝐂𝐨𝐥𝐥𝐚𝐛𝐨𝐫𝐚𝐭𝐢𝐨𝐧 𝐚𝐭 𝐌𝐢𝐞 𝐔𝐧𝐢𝐯𝐞𝐫𝐬𝐢𝐭𝐲 𝐚𝐧𝐝 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐜𝐚𝐥 𝐃𝐞𝐯𝐞𝐥𝐨𝐩𝐦𝐞𝐧𝐭 

• Keynote Speaker: Prof. Subir Sachdev Herchel Smith Professor of Physics at Harvard University.

• Title of the Talks: Quantum Spin Liquids and High - temperature Superconductivity 

CREST hosted the  32nd edition of the Monthly Colloquium Series (Sep'26)

🎙️ Keynote Speaker:  Dr. Nikhil A. Koratkar, John A. Clark and Edward T. Crossan Professor, Dept. of Mechanical, Aerospace and Nuclear Engineering and the Dept. of Materials Science and Engineering, Rensselaer Polytechnic Institute

🧠 Talk Title:  Battery Electrodes: Nano vs Micro-Structuring  

• CREST has launched the Arch-Edge 2026 Scheme with an aim to foster innovation and translational research in semiconductor device design, fabrication, and testing. The specific objectives of this program are as follows:

• Develop architectures supporting edge computing especially for AI/ML workloads

• Prototype the proposed solution on hardware platforms including but not limited to FPGAs

• Promote reusable hardware IPs and open architecture frameworks

• Tape out a test chip and validate the functionality

• Foster interdisciplinary collaboration and student/PhD training

• Bridge academic research to industry-deployable prototypes and future ASIC tape-outs